Research

Focus

Nexys Core Strengths
  • System-level performance, power, thermal modeling, analysis and optimization
  • System-level reliability, robustness, and system lifetime modeling and optimization
  • Test and diagnosis
  • On-chip communication fabrics
  • Manufacturing process or system parameter variability impact and mitigation at architecture and system level
  • 3D integration, modeling, fabrication, and enhanced physical design tools
  • Advanced memory design, including phase-change and magnetoresitive RAM.
Cross-Cutting Application Domains
  • Embedded, high-performance, mixed-technology, cyber-physical, reconfigurable systems and FPGAs.
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Coverage

Power, Thermal, sustainability Reliability, variability Test, diagnosis On-chip fabrics 3D integration Memory systems Embedded High Performance CPS FPGA Reconfigurable
Shawn Blanton (CMU) x x x x
Yiran Chen (Pitt) x x x
Chita Das (PSU) x x x x
Mary-Jane Irwin (PSU) x x x x x
Alex Jones (Pitt) x x x x
Steve Levitan (Pitt) x x x x x x x
Diana Marculescu (CMU) x x x x x x x x
Radu Marculescu (CMU) x x x x x x x x
Vijay Narayanan (PSU) x x x x x x x
Don Thomas (CMU) x x x x x
Yuan Xie (PSU) x x x x
Jun Yang (Pitt) x x x x x x x

Coverage Chart

Shawn Blanton, CMU
Reliability, variablity. Test, diagnosis. Embedded. Reconfigurable.
Yiran Chen, Pitt
Power, Thermal, sustainability. Memory Systems. High Performance.
Chita Das, PSU
Power, Thermal, sustainability. On-chip fabrics. Embedded, High Performance.
Mary-Jane Irwin, PSU
Power, Thermal, sustainability. 3D integration. Memory Systems. Embedded. High Performance.
Alex Jones, Pitt
Power, Thermal, sustainability. Reliability, variablity. High Performance, Reconfigurable
Steve Levitan, Pitt
Power, Thermal, sustainability. Reliability, variablity. On-chip fabrics. Memory Systems. Embedded. High Performance. Reconfigurable.
Diana Marculescu, CMU
Power, Thermal, sustainability. Reliability, variablity. 3D integration. Embedded. High Performance. CPS. FPGA. Reconfigurable.
Radu Marculescu, CMU
Power, Thermal, sustainability. Reliability, variablity. On-chip fabrics. Embedded. High Performance. CPS. FPGA. Reconfigurable.
Vijay Narayanan, PSU
Power, Thermal, sustainability. On-chip fabrics. On-chip fabrics. 3D integration. Embedded. High Performance. FPGA. Reconfigurable.
Don Thomas, CMU
Reliability, variablity. On-chip fabrics. 3D integration. Embedded. CPS. FPGA.
Yuan Xie, PSU
Power, Thermal, sustainability. On-chip fabrics. 3D integration. Embedded. High Performance.
Jun Yang, Pitt
Power, Thermal, sustainability. Reliability, variablity. On-chip fabrics. 3D integration. Memory Systems. High Performance. Reconfigurable.